RD38F3040L0YTQ0

Specifications

HTS Kodu

8542.32.00.71

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

R-PBGA-B88

Number Of Terminals

88

Part Life Cycle Code

Obsolete

Yüzey Montaj

YES

Terminal Pozisyonu

BOTTOM

REACH Uyumluluk Kodu

unknown

Package Code

FBGA

Package Style

GRID ARRAY, FINE PITCH

Memory Ic Type

MEMORY CIRCUIT

Package Shape

RECTANGULAR

Rohs Code

No

Supply Currentmax

0.035 mA

Qualification Status

Not Qualified

Access Timemax

88 ns

Mixed Memory Type

FLASH+PSRAM

ECCN Kodu

EAR99

Supply Voltagenom Vsup

1.8 V

Ihs Manufacturer

MICRON TECHNOLOGY INC

Terminal Formu

BALL

Package Equivalence Code

BGA88,8X12,32

Package Description

FBGA, BGA88,8X12,32

Terminal Adımı

0.8 mm