PF38F5070M0Y0V0

Specifications

Package Code

FBGA

Package Body Material

PLASTIC/EPOXY

Ihs Manufacturer

MICRON TECHNOLOGY INC

ECCN Kodu

EAR99

Mixed Memory Type

FLASH+PSRAM

Package Description

FBGA, BGA165,12X15,25

Terminal Adımı

0.635 mm

Qualification Status

Not Qualified

Yüzey Montaj

YES

Package Equivalence Code

BGA165,12X15,25

Jesd30 Code

R-PBGA-B165

Part Life Cycle Code

Obsolete

Number Of Terminals

165

REACH Uyumluluk Kodu

compliant

Standby Currentmax

0.00016 A

Terminal Pozisyonu

BOTTOM

Package Shape

RECTANGULAR

Terminal Formu

BALL

Rohs Code

Yes

Package Style

GRID ARRAY, FINE PITCH

Supply Voltagenom Vsup

1.8 V

HTS Kodu

8542.32.00.71

Memory Ic Type

MEMORY CIRCUIT

Access Timemax

96 ns