Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Supply Currentmax
- 0.055 mA
- Memory Ic Type
- MEMORY CIRCUIT
- Rohs Code
- Yes
- Yüzey Montaj
- YES
- Package Equivalence Code
- BGA88,8X12,32
- Part Life Cycle Code
- Obsolete
- REACH Uyumluluk Kodu
- compliant
- Mixed Memory Type
- FLASH+PSRAM
- ECCN Kodu
- EAR99
- Package Description
- FBGA, BGA88,8X12,32
- Qualification Status
- Not Qualified
- HTS Kodu
- 8542.32.00.71
- Package Shape
- RECTANGULAR
- Operating Temperaturemax
- 85 °C
- Terminal Formu
- BALL
- Package Style
- GRID ARRAY, FINE PITCH
- Operating Temperaturemin
- -25 °C
- Jesd30 Code
- R-PBGA-B88
- Number Of Terminals
- 88
- Standby Currentmax
- 0.000005 A
- Terminal Pozisyonu
- BOTTOM
- Ihs Manufacturer
- MICRON TECHNOLOGY INC
- Package Body Material
- PLASTIC/EPOXY
- Package Code
- FBGA
- Terminal Adımı
- 0.8 mm
- Temperature Grade
- OTHER
Related Products
Phoenix Contact
1051328
Specialized Modules
Phoenix Contact
1105099
Specialized Modules
Phoenix Contact
1105100
Specialized Modules
Phoenix Contact
1105101
Specialized Modules
Phoenix Contact
1105102
Specialized Modules
Phoenix Contact
1105103
Specialized Modules
Phoenix Contact
1105104
Specialized Modules
Phoenix Contact
1105105
Specialized Modules

