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C3 ChipZentronix

Micron Technology Inc

PF38F1030W0YBQF

Specialized Modules

RoHS: Compliant

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Compliant

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Specifications

Supply Currentmax
0.055 mA
Memory Ic Type
MEMORY CIRCUIT
Rohs Code
Yes
Yüzey Montaj
YES
Package Equivalence Code
BGA88,8X12,32
Part Life Cycle Code
Obsolete
REACH Uyumluluk Kodu
compliant
Mixed Memory Type
FLASH+PSRAM
ECCN Kodu
EAR99
Package Description
FBGA, BGA88,8X12,32
Qualification Status
Not Qualified
HTS Kodu
8542.32.00.71
Package Shape
RECTANGULAR
Operating Temperaturemax
85 °C
Terminal Formu
BALL
Package Style
GRID ARRAY, FINE PITCH
Operating Temperaturemin
-25 °C
Jesd30 Code
R-PBGA-B88
Number Of Terminals
88
Standby Currentmax
0.000005 A
Terminal Pozisyonu
BOTTOM
Ihs Manufacturer
MICRON TECHNOLOGY INC
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Terminal Adımı
0.8 mm
Temperature Grade
OTHER

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