+90 533 300 32 01
C3 ChipZentronix

Micron Technology Inc

PC28F128P33BF60

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Number Of Words Code
8000000
HTS Kodu
8542.32.00.51
ECCN Kodu
EAR99
REACH Uyumluluk Kodu
compliant
Temperature Grade
INDUSTRIAL
Genişlik
8 mm
Package Description
BGA-64
Yüzey Montaj
YES
Jesd30 Code
R-PBGA-B64
Seated Heightmax
1.2 mm
Memory Density
134217728 bit
Boot Block
BOTTOM
Terminal Kaplaması
TIN SILVER COPPER
Rohs Code
Yes
Memory Ic Type
FLASH
Tepe Reflow Süresi (maks. sn)
30
Supply Voltagemax Vsup
3.6 V
Terminal Adımı
1 mm
Package Style
GRID ARRAY, THIN PROFILE
Package Body Material
PLASTIC/EPOXY
Tepe Reflow Sıcaklığı (°C)
260
Uzunluk
10 mm
Number Of Terminals
64
Terminal Formu
BALL
Part Life Cycle Code
Active
Operating Mode
SYNCHRONOUS
JESD-609 Kodu
e1
Access Timemax
60 ns
Programming Voltage
3 V
Parallelserial
PARALLEL
Package Code
TBGA
Package Shape
RECTANGULAR
Supply Voltagenom Vsup
3 V
Organization
8MX16
Operating Temperaturemax
85 °C
Number Of Words
8388608 words
Memory Width
16
Terminal Pozisyonu
BOTTOM
Supply Voltagemin Vsup
2.3 V
Tip
NOR TYPE

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