NAND98R3M2AZBB5E

Specifications

Terminal Adımı

0.8 mm

Package Shape

RECTANGULAR

Terminal Pozisyonu

BOTTOM

Package Code

FBGA

Qualification Status

Not Qualified

REACH Uyumluluk Kodu

compliant

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Supply Voltagenom Vsup

1.8 V

Mixed Memory Type

FLASH+SDRAM

Package Equivalence Code

BGA107,10X14,32

Kurşunsuz Kodu

Yes

Jesd30 Code

R-PBGA-B107

Package Style

GRID ARRAY, FINE PITCH

Part Life Cycle Code

Obsolete

Memory Ic Type

MEMORY CIRCUIT

Part Package Code

BGA

Temperature Grade

OTHER

Ihs Manufacturer

MICRON TECHNOLOGY INC

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Rohs Code

Yes

Pin Sayısı

107

Package Body Material

PLASTIC/EPOXY

Package Description

FBGA, BGA107,10X14,32

HTS Kodu

8542.32.00.71

Number Of Terminals

107

Operating Temperaturemin

-30 °C

Operating Temperaturemax

85 °C

Terminal Formu

BALL

ECCN Kodu

EAR99

Yüzey Montaj

YES