NAND98R3M0AZBB5E

Specifications

Package Style

GRID ARRAY, FINE PITCH

Jesd30 Code

R-PBGA-B107

Package Equivalence Code

BGA107,10X14,32

Part Life Cycle Code

Obsolete

REACH Uyumluluk Kodu

compliant

Qualification Status

Not Qualified

Package Code

FBGA

Mixed Memory Type

FLASH+SDRAM

Supply Voltagenom Vsup

1.8 V

Terminal Pozisyonu

BOTTOM

Package Shape

RECTANGULAR

Terminal Adımı

0.8 mm

ECCN Kodu

EAR99

Yüzey Montaj

YES

HTS Kodu

8542.32.00.71

Terminal Formu

BALL

Operating Temperaturemax

85 °C

Operating Temperaturemin

-30 °C

Number Of Terminals

107

Ihs Manufacturer

MICRON TECHNOLOGY INC

Temperature Grade

OTHER

Package Description

FBGA, BGA107,10X14,32

Package Body Material

PLASTIC/EPOXY

Rohs Code

Yes

Memory Ic Type

MEMORY CIRCUIT