MT28C3212P2FL-11TET

Specifications

Part Package Code

BGA

Additional Feature

SRAM ORGANISATION IS 128K X 16

Operating Temperaturemax

85 °C

Seated Heightmax

1.4 mm

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Memory Density

33554432 bit

Memory Width

16

Supply Voltagemax Vsup

2.2 V

Standby Currentmax

0.00006 A

HTS Kodu

8542.32.00.71

Number Of Words

2097152 words

Package Body Material

PLASTIC/EPOXY

Part Life Cycle Code

Obsolete

Terminal Pozisyonu

BOTTOM

REACH Uyumluluk Kodu

not_compliant

Number Of Terminals

66

Temperature Grade

INDUSTRIAL

Organization

2MX16

Terminal Formu

BALL

Jesd30 Code

R-PBGA-B66

Terminal Kaplaması

Tin/Lead (Sn/Pb)

Memory Ic Type

MEMORY CIRCUIT

JESD-609 Kodu

e0

Operating Temperaturemin

-40 °C

Package Description

FBGA-66

Uzunluk

12 mm

Supply Voltagemin Vsup

1.65 V

Fonksiyon Sayısı

1

Ihs Manufacturer

MICRON TECHNOLOGY INC

Number Of Words Code

2000000

Package Code

LFBGA

Access Timemax

110 ns

Operating Mode

ASYNCHRONOUS

Genişlik

8 mm

Mixed Memory Type

FLASH+SRAM

ECCN Kodu

EAR99

Package Equivalence Code

BGA66,8X12,32

Yüzey Montaj

YES

Package Shape

RECTANGULAR

Terminal Adımı

0.8 mm