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C3 ChipZentronix
MT9HTF3272AY-53EB3

Micron Technology

MT9HTF3272AY-53EB3

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Technical team support

Specifications

Module Density
256Mbyte
Ambalaj
Tray
Mounting
Socket
Package Width
2.7(Max)
Number Of Chip Per Module
9
Package Height
30.5(Max)
Number Of Ranks
Single
Eccn Us
4A994.a
Maximum Operating Supply Voltage V
1.9
Standard Package Name
DIM
Typical Operating Supply Voltage V
1.8
Minimum Operating Temperature C
0
Pin Sayısı
240
Organization
32Mx72
Supplier Package
UDIMM
Maximum Clock Rate Mhz
533
Operating Current Ma
1440
RoHS Durumu
Yes with exemptions
Data Bus Width Bit
72
Minimum Operating Supply Voltage V
1.7
Ecc Support
Yes
Module
DRAM Module
Supplier Temperature Grade
Commercial
Package Length
133.5(Max)
Pcb Changed
240
Maximum Operating Temperature C
85
Chip Density Bit
256M
Max Access Time Ns
0.05
Parça Durumu
Obsolete
Lead Shape
No Lead
Cas Latency
4
Chip Configuration
32Mx8
Module Type
240UDIMM

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