MT4LSDT1664AG-13EG1

Specifications

Chip Density Bit

256M

Pc Type

PC-133

Ambalaj

Tray

Eccn Us

EAR99

Package Width

3.18(Max)

Parça Durumu

Unconfirmed

Maximum Clock Rate Mhz

133

Minimum Operating Supply Voltage V

3

RoHS Durumu

RoHS non-compliant

Operating Current Ma

540

Mounting

Socket

Pll

No

Number Of Chip Per Module

4

Self Refresh

Yes

Minimum Operating Temperature C

0

Max Access Time Ns

5.4

Module Density

128Mbyte

Spd Eeprom Support

Yes

Maximum Operating Temperature C

65

Chip Configuration

16Mx16

Module

DRAM Module

Supplier Temperature Grade

Commercial

Pin Sayısı

168

Refresh Cycles

8K

Lead Shape

No Lead

Module Type

168UDIMM

Module Sides

Single

Standard Package Name

DIM

Package Height

25.53(Max)

Organization

16Mx64

Maximum Operating Supply Voltage V

3.6

Number Of Ranks

Single

Data Bus Width Bit

64

Ecc Support

No

Package Length

133.5(Max)

Supplier Package

DIMM

Number Of Chip Banks

4

Cas Latency

2

Pcb Changed

168

Typical Operating Supply Voltage V

3.3