NAND08GAH0BZA5F

Specifications

Temperature Grade

OTHER

Ihs Manufacturer

MICRON TECHNOLOGY INC

Terminal Pozisyonu

BOTTOM

Rohs Code

Yes

Package Body Material

PLASTIC/EPOXY

Package Description

FBGA, BGA169,14X28,20

Terminal Adımı

0.5 mm

Package Shape

RECTANGULAR

Memory Density

8589934592 bit

Package Equivalence Code

BGA169,14X28,20

Jesd30 Code

R-PBGA-B169

Package Style

GRID ARRAY, FINE PITCH

Yüzey Montaj

YES

Risk Rank

5.83

Part Life Cycle Code

Obsolete

Power Supplies

1.8/3,3 V

Package Code

FBGA

Qualification Status

Not Qualified

REACH Uyumluluk Kodu

unknown

Üretici Parça No

NAND08GAH0BZA5F

Number Of Terminals

169

Operating Temperaturemin

-25 °C

Operating Temperaturemax

85 °C

Terminal Formu

BALL