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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Temperature Grade
- OTHER
- Ihs Manufacturer
- MICRON TECHNOLOGY INC
- Terminal Pozisyonu
- BOTTOM
- Rohs Code
- Yes
- Package Body Material
- PLASTIC/EPOXY
- Package Description
- FBGA, BGA169,14X28,20
- Terminal Adımı
- 0.5 mm
- Package Shape
- RECTANGULAR
- Memory Density
- 8589934592 bit
- Package Equivalence Code
- BGA169,14X28,20
- Jesd30 Code
- R-PBGA-B169
- Package Style
- GRID ARRAY, FINE PITCH
- Yüzey Montaj
- YES
- Risk Rank
- 5.83
- Part Life Cycle Code
- Obsolete
- Power Supplies
- 1.8/3,3 V
- Package Code
- FBGA
- Qualification Status
- Not Qualified
- REACH Uyumluluk Kodu
- unknown
- Üretici Parça No
- NAND08GAH0BZA5F
- Number Of Terminals
- 169
- Operating Temperaturemin
- -25 °C
- Operating Temperaturemax
- 85 °C
- Terminal Formu
- BALL