SST55LC100M-45-C-BWE

Specifications

Terminal Formu

BALL

Tepe Reflow Süresi (maks. sn)

40

Genişlik

9 mm

JESD-609 Kodu

e1

External Data Bus Width

16

Jesd30 Code

S-PBGA-B84

Temperature Grade

COMMERCIAL

Tepe Reflow Sıcaklığı (°C)

260

Supply Voltagemax

3.465 V

Drive Interface Standard

IDE

Upsucsperipheral Ics Type

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

HTS Kodu

8542.31.00.01

Package Description

9 X 9 MM, ROHS COMPLIANT, TFBGA-84

Terminal Kaplaması

TIN SILVER COPPER

Operating Temperaturemax

70 °C

Part Life Cycle Code

Active

Package Shape

SQUARE

Terminal Adımı

0.8 mm

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Seated Heightmax

1.2 mm

Supply Voltagenom

3.3 V

Number Of Terminals

84

Package Body Material

PLASTIC/EPOXY

Host Interface Standard

ATA

Host Data Transfer Ratemax

10 MBps

Terminal Pozisyonu

BOTTOM

Part Package Code

BGA

Pin Sayısı

84

Yüzey Montaj

YES

Uzunluk

9 mm

Package Code

TFBGA

Kurşunsuz Kodu

Yes

Rohs Code

Yes

Qualification Status

Not Qualified

Supply Voltagemin

3.135 V

REACH Uyumluluk Kodu

compliant