Volume pricing
- 1+ pcs$395.82
- 10+ pcs$373.41
- 100+ pcs$352.28
- 500+ pcs$332.34
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- JESD-609 Kodu
- e1
- Paket
- Tray
- Kılıf / Paket
- FBGA
- Tradename
- Fusion
- Maximum Operating Frequency
- 1282.05 MHz
- Number Of Gates
- 600000
- Package Shape
- SQUARE
- Montaj Tipi
- Surface Mount
- Number Of Equivalent Gates
- 600000
- Uzunluk
- 17 mm
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Formu
- BALL
- Supply Voltagemin
- 1.425 V
- Package Style
- GRID ARRAY, LOW PROFILE
- RoHS
- Details
- Package Body Material
- PLASTIC/EPOXY
- Yüzey Montaj
- YES
- Moisture Sensitivity Levels
- 3
- Birim Ağırlık
- 0.014110 oz
- Operating Supply Voltage
- 1.5 V
- Minimum Operating Temperature
- - 40 C
- Reflow Temperaturemax S
- 40
- Tepe Reflow Sıcaklığı (°C)
- 260
- Montaj Stili
- SMD/SMT
- Çalışma Sıcaklığı
- -40°C ~ 85°C (TA)
- Part Life Cycle Code
- Active
- Number Of Ios
- 119 I/O
- Operating Temperaturemin
- -40 °C
- Risk Rank
- 5.3
- Terminal Adımı
- 1 mm
- Temperature Grade
- INDUSTRIAL
- Ambalaj
- Tray
- Genişlik
- 17 mm
- Fabrika Paket Adedi
- 90
- Yükseklik
- 1.2 mm
- Qualification Status
- Not Qualified
- Moisture Sensitive
- Yes
- Tedarikçi Cihaz Paketi
- 256-FPBGA (17x17)
- Package Code
- LBGA
- Speed Grade
- 1