Volume pricing
- 1+ pcs$351.90
- 10+ pcs$331.98
- 100+ pcs$313.19
- 500+ pcs$295.46
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tradename
- Fusion
- Çalışma Sıcaklığı
- -55°C ~ 100°C (TJ)
- Tepe Reflow Sıcaklığı (°C)
- 225
- RoHS
- N
- Package Body Material
- PLASTIC/EPOXY
- Yüzey Montaj
- YES
- REACH Uyumluluk Kodu
- compliant
- Moisture Sensitive
- Yes
- Besleme Gerilimi
- 1.425V ~ 1.575V
- Package Code
- BGA
- Package Equivalence Code
- BGA484,22X22,40
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Number Of Logic Cells
- 13824
- Üretici Parça No
- M1AFS600-FG484K
- Ambalaj
- Tray
- Clock Frequencymax
- 350 MHz
- Qualification Status
- Not Qualified
- Ram Size
- 13.5 kB
- Jesd30 Code
- S-PBGA-B484
- Total Ram Bits
- 110592
- Rohs Code
- No
- Ihs Manufacturer
- MICROSEMI CORP
- Package Style
- GRID ARRAY
- Montaj Tipi
- Surface Mount
- HTS Kodu
- 8542.39.00.01
- Reflow Temperaturemax S
- 20
- Terminal Formu
- BALL
- Package Description
- BGA, BGA484,22X22,40
- Risk Rank
- 5.87
- Part Life Cycle Code
- Active
- Maks. Çalışma Sıcaklığı
- 100 °C
- Number Of Terminals
- 484
- Number Of Ios
- 172
- Number Of Inputs
- 172
- JESD-609 Kodu
- e0
- Tedarikçi Cihaz Paketi
- 484-FPBGA (23x23)
- Terminal Pozisyonu
- BOTTOM
- Package Shape
- SQUARE
- Temel Ürün No
- M1AFS600
- Moisture Sensitivity Levels
- 3