Volume pricing
- 1+ pcs$312.08
- 10+ pcs$294.42
- 100+ pcs$277.75
- 500+ pcs$262.03
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Seated Heightmax
- 1.68 mm
- Maximum Operating Frequency
- 1470.59 MHz
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Organization
- 6144 CLBS, 250000 GATES
- Ambalaj
- Tray
- Üretici Parça No
- M1AFS250-2FGG256I
- Operating Temperaturemax
- 85 °C
- REACH Uyumluluk Kodu
- compliant
- Yüzey Montaj
- YES
- Supply Voltagenom
- 1.5 V
- Tepe Reflow Sıcaklığı (°C)
- 260
- Genişlik
- 17 mm
- Tradename
- Fusion
- Çalışma Sıcaklığı
- -40°C ~ 100°C (TJ)
- RoHS
- Details
- Package Body Material
- PLASTIC/EPOXY
- Besleme Gerilimi
- 1.425V ~ 1.575V
- Moisture Sensitive
- Yes
- Package Code
- LBGA
- Montaj Stili
- SMD/SMT
- Package Style
- GRID ARRAY, LOW PROFILE
- Temperature Grade
- INDUSTRIAL
- Montaj Tipi
- Surface Mount
- HTS Kodu
- 8542.39.00.01
- Yükseklik
- 1.2 mm
- Jesd30 Code
- S-PBGA-B256
- Qualification Status
- Not Qualified
- Birim Ağırlık
- 0.014110 oz
- Ihs Manufacturer
- MICROSEMI CORP
- Rohs Code
- Yes
- Total Ram Bits
- 36864
- Terminal Pozisyonu
- BOTTOM
- Operating Supply Voltage
- 1.5 V
- Package Shape
- SQUARE
- JESD-609 Kodu
- e1
- Number Of Ios
- 114 I/O
- Tedarikçi Cihaz Paketi
- 256-FPBGA (17x17)
- Moisture Sensitivity Levels
- 3
- Supply Voltagemin
- 1.425 V
- Technology
- CMOS