Volume pricing
- 1+ pcs$1.00
- 10+ pcs$1.00
- 25+ pcs$1.00
- 50+ pcs$1.00
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- REACH Uyumluluk Kodu
- unknown
- Package Style
- GRID ARRAY, LOW PROFILE
- Jesd30 Code
- S-PBGA-B256
- Number Of Equivalent Gates
- 250000
- Yüzey Montaj
- YES
- Uzunluk
- 17 mm
- Usage Level
- Military grade
- Ürün Durumu
- Active
- Üretici Parça No
- AX250-FG256M
- Package Code
- LBGA
- Reflow Temperaturemax S
- 30
- Package Equivalence Code
- BGA256,16X16,40
- Paket
- Tray
- Terminal Formu
- BALL
- Fabrika Paket Adedi
- 90
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Çalışma Sıcaklığı
- -55°C ~ 125°C (TA)
- Risk Rank
- 5.25
- Moisture Sensitive
- Yes
- Moisture Sensitivity Levels
- 3
- Terminal Pozisyonu
- BOTTOM
- Seated Heightmax
- 1.7 mm
- Additional Feature
- 250000 SYSTEM GATES AVAILABLE
- Total Ram Bits
- 55296
- Birim Ağırlık
- 0.014110 oz
- Seri
- AX250
- Number Of Labsclbs
- 4224
- Package Shape
- SQUARE
- Minimum Operating Temperature
- - 55 C
- Operating Supply Voltage
- 1.5 V
- Number Of Gates
- 250000
- Tedarikçi Cihaz Paketi
- 256-FPBGA (17x17)
- Tepe Reflow Sıcaklığı (°C)
- 225
- Number Of Logic Cells
- 4224
- Ambalaj
- Tray
- Number Of Clbs
- 2816
- Kılıf / Paket
- FBGA
- RoHS
- N
- Organization
- 2816 CLBS, 250000 GATES
- Rohs Code
- No