Volume pricing
- 1+ pcs$484.65
- 10+ pcs$457.22
- 100+ pcs$431.34
- 500+ pcs$406.92
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- GRID ARRAY, LOW PROFILE
- Number Of Terminals
- 256
- Moisture Sensitive
- Yes
- Montaj Stili
- SMD/SMT
- Yüzey Montaj
- YES
- Package Shape
- SQUARE
- Maks. Çalışma Sıcaklığı
- + 85 C
- Tradename
- Fusion
- Package Body Material
- PLASTIC/EPOXY
- Terminal Adımı
- 1 mm
- Ram Size
- 33.8 kB
- RoHS
- Details
- Tedarikçi Cihaz Paketi
- 256-FPBGA (17x17)
- Operating Temperaturemax
- 85 °C
- Qualification Status
- Not Qualified
- Package Code
- LBGA
- Organization
- 1500000 GATES
- Supply Voltagenom
- 1.5 V
- Montaj Tipi
- Surface Mount
- Technology
- CMOS
- Min. Çalışma Sıcaklığı
- -40 °C
- Radyasyon Dayanımı
- No
- Pin Sayısı
- 256
- Operating Temperaturemin
- -40 °C
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- REACH Uyumluluk Kodu
- compliant
- Number Of Registers
- 38400
- Besleme Gerilimi
- 1.425V ~ 1.575V
- Çalışma Sıcaklığı
- -40°C ~ 100°C (TJ)
- Max Frequency
- 1.47059 GHz
- Ihs Manufacturer
- MICROSEMI CORP
- Package Description
- LBGA,
- Ürün Durumu
- Active
- Kılıf / Paket
- FBGA
- Max Supply Voltage
- 1.575 V
- Number Of Ios
- 119 I/O
- Part Life Cycle Code
- Active
- Number Of Gates
- 1500000
- Speed Grade
- 2
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)