Volume pricing
- 1+ pcs$271.10
- 10+ pcs$255.75
- 100+ pcs$241.28
- 500+ pcs$227.62
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Body Material
- PLASTIC/EPOXY
- Ram Size
- 33.8 kB
- Terminal Adımı
- 1 mm
- RoHS
- N
- Tedarikçi Cihaz Paketi
- 484-FPBGA (23x23)
- Operating Temperaturemax
- 85 °C
- Package Style
- GRID ARRAY
- Number Of Terminals
- 484
- Moisture Sensitive
- Yes
- Montaj Stili
- SMD/SMT
- Tradename
- Fusion
- Maks. Çalışma Sıcaklığı
- + 70 C
- Package Shape
- SQUARE
- Yüzey Montaj
- YES
- Package Code
- BGA
- Organization
- 38400 CLBS, 1500000 GATES
- Supply Voltagenom
- 1.5 V
- Number Of Clbs
- 38400
- Montaj Tipi
- Surface Mount
- Technology
- CMOS
- Qualification Status
- Not Qualified
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- REACH Uyumluluk Kodu
- unknown
- Number Of Registers
- 38400
- Besleme Gerilimi
- 1.425V ~ 1.575V
- Min. Çalışma Sıcaklığı
- 0 °C
- Radyasyon Dayanımı
- No
- Pin Sayısı
- 484
- Ürün Durumu
- Active
- Package Description
- BGA,
- Kılıf / Paket
- FBGA
- Max Supply Voltage
- 1.575 V
- Number Of Ios
- 223 I/O
- Ihs Manufacturer
- MICROSEMI CORP
- Max Frequency
- 1.28205 GHz
- Çalışma Sıcaklığı
- 0°C ~ 85°C (TJ)
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Speed Grade
- 1
- Seri
- AFS1500
- Reflow Temperaturemax S
- 30