Volume pricing
- 1+ pcs$8.83
- 10+ pcs$8.33
- 100+ pcs$7.86
- 500+ pcs$7.42
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
- Number Of Equivalent Gates
- 20000
- Package Body Material
- UNSPECIFIED
- Fabrika Paket Adedi
- 260
- Üretici Parça No
- A3PN020-2QNG68I
- Moisture Sensitivity Levels
- 3
- Ambalaj
- Tray
- Moisture Sensitive
- Yes
- Maks. Çalışma Sıcaklığı
- + 85 C
- Package Description
- HVQCCN,
- Number Of Ios
- 49 I/O
- REACH Uyumluluk Kodu
- compliant
- Package Code
- HVQCCN
- Number Of Terminals
- 68
- Operating Supply Voltage
- 1.5 V
- Ihs Manufacturer
- MICROSEMI CORP
- HTS Kodu
- 8542.39.00.01
- Terminal Pozisyonu
- QUAD
- Kılıf / Paket
- QFN EP
- Operating Temperaturemax
- 85 °C
- Yükseklik
- 0.88 mm
- Supply Voltagemax
- 1.575 V
- Reflow Temperaturemax S
- 30
- Rohs Code
- Yes
- Uzunluk
- 8 mm
- Risk Rank
- 5.26
- Operating Supply Current
- 1 mA
- Minimum Operating Temperature
- - 40 C
- Temel Ürün No
- A3PN020
- Montaj Tipi
- Surface Mount
- Speed Grade
- 2
- Number Of Clbs
- 520
- Package Shape
- SQUARE
- Tepe Reflow Sıcaklığı (°C)
- 260
- Seri
- A3PN020
- Jesd30 Code
- S-XQCC-N68
- Tradename
- ProASIC3 nano
- Paket
- Tray
- Seated Heightmax
- 1 mm
- Tedarikçi Cihaz Paketi
- 68-QFN (8x8)