Volume pricing
- 1+ pcs$123.31
- 10+ pcs$116.33
- 100+ pcs$109.74
- 500+ pcs$103.53
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ambalaj
- Tray
- Birim Ağırlık
- 0.014110 oz
- REACH Uyumluluk Kodu
- compliant
- Number Of Ios
- 165 I/O
- Maks. Çalışma Sıcaklığı
- + 70 C
- Package Description
- BGA,
- Moisture Sensitive
- Yes
- Typical Operating Supply Voltage
- 1.5000 V
- Package Body Material
- PLASTIC/EPOXY
- Number Of Equivalent Gates
- 600000
- Package Style
- GRID ARRAY
- Moisture Sensitivity Levels
- 3
- Üretici Parça No
- A3PE600-2FGG256
- Fabrika Paket Adedi
- 90
- Operating Temperaturemax
- 70 °C
- Yükseklik
- 1.2 mm
- Kılıf / Paket
- FBGA
- Terminal Pozisyonu
- BOTTOM
- HTS Kodu
- 8542.39.00.01
- Maximum Operating Supply Voltage
- 1.575 V
- Minimum Operating Supply Voltage
- 1.425 V
- Package Code
- BGA
- Total Ram Bits
- 110592
- Ihs Manufacturer
- MICROSEMI CORP
- Operating Supply Voltage
- 1.5 V
- Number Of Terminals
- 256
- Number Of Clbs
- 13824
- JESD-609 Kodu
- e1
- Terminal Formu
- BALL
- Tedarikçi Cihaz Paketi
- 256-FPBGA (17x17)
- Seated Heightmax
- 1.8 mm
- Paket
- Tray
- Tradename
- ProASIC3
- Jesd30 Code
- S-PBGA-B256
- Seri
- A3PE600
- Shipping Restrictions
- This product may require additional documentation to export from the United States.
- Tepe Reflow Sıcaklığı (°C)
- 260
- Package Shape
- SQUARE
- Uzunluk
- 17 mm
- Risk Rank
- 5.3