Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ram Size
- 857.6KB
- Çalışma Sıcaklığı
- -55°C ~ 105°C
- Parça Durumu
- Active
- Pitch Post
- 0.100 (2.54mm)
- Contact Finish Post
- Tin
- Housing Material
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Peripherals
- DMA, PCI, PWM
- Flash Size
- 128KB
- Contact Material Mating
- Beryllium Copper
- Ürün Durumu
- Active
- Seri
- PGM
- Ambalaj
- Bulk
- Architecture
- MPU, FPGA
- Contact Finish Mating
- Gold
- Termination Post Length
- 0.165 (4.19mm)
- Pitch Mating
- 0.100 (2.54mm)
- Tedarikçi Cihaz Paketi
- 484-FCBGA (19x19)
- Core Processor
- RISC-V
- Number Of Ios
- MCU - 136, FPGA - 108
- Akım Değeri
- 3A
- Connectivity
- CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Primary Attributes
- FPGA - 93K Logic Modules
- Paket
- Tray
- Montaj Tipi
- Through Hole
- Tip
- PGA
- Kılıf / Paket
- 484-BFBGA, FCBGA
- Contact Finish Thickness Mating
- 10.0µin (0.25µm)
- Terminal
- Solder
- Material Flammability Rating
- UL94 V-0
- Contact Material Post
- Brass
- Contact Finish Thickness Post
- 200.0µin (5.08µm)