Volume pricing
- 1+ pcs$383.28
- 10+ pcs$361.58
- 100+ pcs$341.12
- 500+ pcs$321.81
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Equivalence Code
- BGA676,26X26,40
- Reflow Temperaturemax S
- 30
- Genişlik
- 27 mm
- Supply Voltagemax
- 1.26 V
- Total Ram Bits
- 2648064
- Uzunluk
- 27 mm
- Number Of Inputs
- 425
- Rohs Code
- Yes
- Ürün Durumu
- Active
- Maks. Çalışma Sıcaklığı
- + 100 C
- Supply Voltagenom
- 1.2 V
- Risk Rank
- 5.27
- Power Supplies
- 1.2 V
- Temel Ürün No
- M2GL090
- Package Shape
- SQUARE
- Montaj Stili
- SMD/SMT
- Terminal Formu
- BALL
- Number Of Transceivers
- 4 Transceiver
- Jesd30 Code
- S-PBGA-B676
- Number Of Outputs
- 425
- Number Of Terminals
- 676
- Tepe Reflow Sıcaklığı (°C)
- 260
- Number Of Logic Cells
- 86316
- HTS Kodu
- 8542.39.00.01
- Package Style
- GRID ARRAY
- Çalışma Sıcaklığı
- -40°C ~ 100°C (TJ)
- Operating Supply Voltage
- 1.2 V
- Seated Heightmax
- 2.44 mm
- REACH Uyumluluk Kodu
- compliant
- Paket
- Tray
- Tedarikçi Cihaz Paketi
- 676-FBGA (27x27)
- Package Code
- BGA
- Kılıf / Paket
- 676-BGA
- Qualification Status
- Not Qualified
- Number Of Ios
- 425
- Moisture Sensitivity Levels
- 3
- Seri
- IGLOO2
- Montaj Tipi
- Surface Mount
- Number Of Logic Elementscells
- 86184
- Ihs Manufacturer
- MICROSEMI CORP
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