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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Supply Voltagenom Vsup
- 3.3 V
- Package Style
- GRID ARRAY, VERY THIN PROFILE, FINE PITCH
- Accepts Pin Diameter
- 0.022 ~ 0.025 (0.56mm ~ 0.64mm)
- Contact Finish
- Tin
- Genişlik
- 5 mm
- Contact Finish Thickness
- 100.0µin (2.54µm)
- Number Of Terminals
- 162
- Parça Durumu
- Obsolete
- Terminal Formu
- BALL
- Socket Depth
- 0.125 (3.18mm)
- Technology
- CMOS
- Seated Heightmax
- 0.6 mm
- Package Equivalence Code
- BGA162,9X19,20
- Ambalaj
- Bulk
- Temperature Grade
- INDUSTRIAL
- Part Life Cycle Code
- Active
- Özellikler
- Closed Bottom
- Terminal
- Solder
- Contact Materials
- Beryllium Copper
- Çalışma Sıcaklığı
- -65°C ~ 125°C
- Terminal Adımı
- 0.5 mm
- Analog Ic Other Type
- ANALOG CIRCUIT
- Package Body Material
- PLASTIC/EPOXY
- Üretici Parça No
- ATMXT1664T2-C2UR
- Terminal Pozisyonu
- BOTTOM
- Flange Diameter
- 0.080 (2.03mm)
- Package Shape
- RECTANGULAR
- Uzunluk
- 10 mm
- Package Description
- UFBGA-162
- Fonksiyon Sayısı
- 1
- Operating Temperaturemin
- -40 °C
- Ihs Manufacturer
- MICROCHIP TECHNOLOGY INC
- Supply Voltagemin Vsup
- 3.14 V
- Tail Type
- No Tail
- Mounting Hole Diameter
- 0.062 ~ 0.063 (1.57mm ~ 1.60mm)
- Length Overall
- 0.138 (3.51mm)
- Jesd30 Code
- R-PBGA-B162
- Risk Rank
- 5
- Package Code
- VFBGA
- Supply Voltagemax Vsup
- 3.46 V