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Priced by quantity and lead time.
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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Insulation Materials
- Liquid Crystal Polymer (LCP)
- Seri
- AMPMODU Mod II
- Contact Type
- Male Pin
- Material Flammability Rating
- UL94 V-0
- Memory Size
- 128B RAM, 4kB ROM
- Contact Finish Mating
- Tin
- Tedarikçi Cihaz Paketi
- 20-SSO
- Tip
- TxRx + MCU
- Contact Materials
- Copper Alloy
- Pitch Mating
- 0.100 (2.54mm)
- Contact Length Post
- 0.120 (3.05mm)
- Insulation Height
- 0.090 (2.29mm)
- Montaj Tipi
- Through Hole
- Paket
- Bulk
- Kılıf / Paket
- 20-LSSOP (0.173, 4.40mm Width)
- Contact Finish Thickness Post
- 100.0µin (2.54µm)
- Terminal
- Solder
- Style
- Board to Board or Cable
- Contact Finish Thickness Mating
- 100.0µin (2.54µm)
- Number Of Positions Loaded
- All
- Çalışma Sıcaklığı
- -65°C ~ 105°C
- Temel Ürün No
- 146278
- Sıra Sayısı
- 1
- Besleme Gerilimi
- 1.8V ~ 6.5V
- Ürün Durumu
- Active
- Contact Shape
- Square
- Shrouding
- Unshrouded
- Connector Type
- Header, Breakaway
- Pozisyon Sayısı
- 16
- Overall Contact Length
- 0.440 (11.18mm)
- Current Rating Amps
- 3A
- Contact Lengthmating
- 0.230 (5.84mm)
- Insulation Color
- Black
- Contact Finish Post
- Tin
- Fastening Type
- Push-Pull
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