Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Ram Size
- 33.8 kB
- Terminal Adımı
- 1 mm
- Package Body Material
- PLASTIC/EPOXY
- Tedarikçi Cihaz Paketi
- 676-FBGA (27x27)
- Operating Temperaturemax
- 85 °C
- RoHS
- Compliant
- Package Style
- GRID ARRAY
- Number Of Terminals
- 676
- Package Shape
- SQUARE
- Yüzey Montaj
- YES
- Package Code
- BGA
- Number Of Clbs
- 38400
- Montaj Tipi
- Surface Mount
- Organization
- 38400 CLBS, 1500000 GATES
- Supply Voltagenom
- 1.5 V
- Qualification Status
- Not Qualified
- Number Of Registers
- 38400
- REACH Uyumluluk Kodu
- unknown
- Besleme Gerilimi
- 1.425V ~ 1.575V
- Pin Sayısı
- 676
- Radyasyon Dayanımı
- No
- Min. Çalışma Sıcaklığı
- 0 °C
- Kılıf / Paket
- 676-BGA
- Ürün Durumu
- Active
- Package Description
- BGA,
- Max Supply Voltage
- 1.575 V
- Number Of Ios
- 252
- Ihs Manufacturer
- MICROSEMI CORP
- Max Frequency
- 1.28205 GHz
- Çalışma Sıcaklığı
- 0°C ~ 85°C (TJ)
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Speed Grade
- 1
- Reflow Temperaturemax S
- 30
- Seri
- Fusion®
- Part Life Cycle Code
- Active
- Number Of Gates
- 1.5e+06
- Weight
- 400.011771 mg
- Terminal Pozisyonu
- BOTTOM
- Genişlik
- 25 mm
- Risk Rank
- 5.3
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