MIC3001BML

Specifications

Supply Voltagenom

3.3 V

Package Shape

SQUARE

Package Description

HVQCCN,

HTS Kodu

8542.39.00.01

Terminal Kaplaması

Tin/Lead (Sn85Pb15)

Terminal Adımı

0.5 mm

Package Code

HVQCCN

Terminal Formu

NO LEAD

Seated Heightmax

0.9 mm

Pin Sayısı

24

JESD-609 Kodu

e0

Operating Temperaturemax

105 °C

Package Body Material

UNSPECIFIED

Genişlik

4 mm

Applications

SONET;SDH

Temperature Grade

INDUSTRIAL

Qualification Status

Not Qualified

Uzunluk

4 mm

Rohs Code

No

Ihs Manufacturer

MICREL INC

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

REACH Uyumluluk Kodu

not_compliant

Reflow Temperaturemax S

30

Manufacturer Package Code

MLF

Yüzey Montaj

YES

Terminal Pozisyonu

QUAD

Part Life Cycle Code

Obsolete

Number Of Terminals

24

Operating Temperaturemin

-40 °C

Üretici Parça No

MIC3001BML

Telecom Ic Type

ATM/SONET/SDH SUPPORT CIRCUIT

Risk Rank

5.26

Jesd30 Code

S-XQCC-N24

Fonksiyon Sayısı

1

Part Package Code

DFN

Tepe Reflow Sıcaklığı (°C)

240

Moisture Sensitivity Levels

2