Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- JESD-609 Kodu
- e1
- Qualification Status
- Not Qualified
- Pitch Mating
- 0.100 (2.54mm)
- Terminal Formu
- BALL
- RoHS Durumu
- ROHS3 Compliant
- Kılıf / Paket
- 349-BBGA, CSBGA Exposed Pad
- Seri
- EJECT-A-DIP™
- Housing Material
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Besleme Gerilimi
- 3.135V~3.465V
- Contact Finish Thickness Mating
- 10.0µin (0.25µm)
- Parça Durumu
- Obsolete
- Function
- Single-Chip Transceiver
- Terminal Sayısı
- 400
- Pitch Post
- 0.100 (2.54mm)
- Material Flammability Rating
- UL94 V-0
- Ürün Durumu
- Obsolete
- Paket
- Tray
- Number Of Positions Or Pins Grid
- 24 (2 x 12)
- Number Of Circuits
- 4
- Genişlik
- 27mm
- Özellikler
- Closed Frame
- Tepe Reflow Sıcaklığı (°C)
- 260
- Contact Finish Mating
- Gold
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Interface
- DS3, E3
- Yayın Yılı
- 2006
- Terminal Pozisyonu
- BOTTOM
- Montaj Tipi
- Surface Mount
- Contact Finish Post
- Gold
- Akım Değeri
- 3A
- Tedarikçi Cihaz Paketi
- 400-PBGA (27x27)
- Contact Material Mating
- Beryllium Copper
- Temel Ürün No
- DS3174
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tip
- DIP, 0.6 (15.24mm) Row Spacing
- Terminal Adımı
- 1.27mm
- Nem Hassasiyeti (MSL)
- 5 (48 Hours)
- Terminal
- Wire Wrap
- Ambalaj
- Tray
- ECCN Kodu
- EAR99
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