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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Sıcaklığı (°C)
- 240
- Ihs Manufacturer
- ROCHESTER ELECTRONICS INC
- Part Life Cycle Code
- Active
- Genişlik
- 27 mm
- Part Package Code
- BGA
- Uzunluk
- 27 mm
- Paket
- Bulk
- Package Body Material
- PLASTIC/EPOXY
- Kurşunsuz Kodu
- No
- Fonksiyon Sayısı
- 1
- Package Style
- GRID ARRAY
- Package Shape
- SQUARE
- Package Description
- BGA,
- Package Code
- BGA
- Supply Voltagenom
- 3.3 V
- REACH Uyumluluk Kodu
- unknown
- Telecom Ic Type
- ATM/SONET/SDH NETWORK INTERFACE
- Yüzey Montaj
- YES
- Ürün Durumu
- Obsolete
- Risk Rank
- 5.87
- Montaj Tipi
- Surface Mount
- Terminal Pozisyonu
- BOTTOM
- Pin Sayısı
- 400
- Reflow Temperaturemax S
- NOT SPECIFIED
- Tip
- ATM/Packet PHYs
- Jesd30 Code
- S-PBGA-B400
- Terminal Adımı
- 1.27 mm
- Number Of Terminals
- 400
- Terminal Kaplaması
- TIN LEAD
- Tedarikçi Cihaz Paketi
- 400-TE-PBGA (27x27)
- Kılıf / Paket
- 400-BBGA
- Rohs Code
- No
- Seated Heightmax
- 2.54 mm
- Terminal Formu
- BALL
- Temperature Grade
- COMMERCIAL
- Moisture Sensitivity Levels
- NOT SPECIFIED
- JESD-609 Kodu
- e0
- Qualification Status
- COMMERCIAL
- Operating Temperaturemax
- 70 °C
- Üretici Parça No
- DS3162
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