Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Part Life Cycle Code
- Obsolete
- Terminal Kaplaması
- TIN SILVER COPPER
- Seated Heightmax
- 2 mm
- Terminal Formu
- BALL
- Number Of Terminals
- 256
- Package Description
- 17 X 17 MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, BGA-256
- Package Style
- GRID ARRAY
- Rohs Code
- Yes
- REACH Uyumluluk Kodu
- compliant
- Jesd30 Code
- S-PBGA-B256
- JESD-609 Kodu
- e1
- Terminal Pozisyonu
- BOTTOM
- Address Bus Width
- 26
- Boundary Scan
- YES
- Integrated Cache
- YES
- External Data Bus Width
- 32
- Package Shape
- SQUARE
- Pin Sayısı
- 256
- Qualification Status
- Not Qualified
- Package Body Material
- PLASTIC/EPOXY
- Speed
- 300 MHz
- Package Code
- BGA
- Supply Voltagemin
- 1.045 V
- HTS Kodu
- 8542.31.00.01
- Tepe Reflow Sıcaklığı (°C)
- 250
- Genişlik
- 17 mm
- ECCN Kodu
- 3A001.A.2.C
- Operating Temperaturemin
- -40 °C
- Ihs Manufacturer
- INTEL CORP
- Üretici Parça No
- LUPXA255A0E300
- Operating Temperaturemax
- 100 °C
- Low Power Mode
- YES
- Clock Frequencymax
- 3.6864 MHz
- Format
- FIXED POINT
- Supply Voltagemax
- 1.43 V
- Uzunluk
- 17 mm
- Supply Voltagenom
- 1.1 V
- Reflow Temperaturemax S
- 40
- Yüzey Montaj
- YES
- Upsucsperipheral Ics Type
- MICROPROCESSOR