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Specifications
- Package Description
- 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256
- Genişlik
- 17 mm
- Ihs Manufacturer
- INTEL CORP
- Package Code
- BGA
- Nominal Cross Section Conductor
- 1.31
- Power Supplies
- 1.3,2.5/3.3,3.3 V
- Operating Temperaturemax
- 100 °C
- Üretici Parça No
- GDPXA255A0E400
- Part Package Code
- BGA
- Terminal Formu
- BALL
- Temperature Grade
- INDUSTRIAL
- Nominal Voltage U
- 1000
- Address Bus Width
- 26
- External Data Bus Width
- 32
- Screen Over Stranding Element
- None
- Stranding Element
- No
- Speed
- 400 MHz
- Screen Over Stranding
- Braiding
- Boundary Scan
- YES
- Technology
- CMOS
- Core Identification
- Numbers
- Supply Voltagemin
- 1.235 V
- Package Body Material
- PLASTIC/EPOXY
- Risk Rank
- 5.85
- Colour Outer Sheath
- Grey
- Outer Diameter Approx
- 9.6
- Low Power Mode
- YES
- Operating Temperaturemin
- -40 °C
- Seated Heightmax
- 2 mm
- Upsucsperipheral Ics Type
- MICROPROCESSOR
- Min Permitted Bending Radius Moving Applicationfree Movement
- 58
- Package Shape
- SQUARE
- Low Smoke According To En610342
- No
- Bit Size
- 32
- Package Equivalence Code
- BGA256,16X16,40
- Number Of Terminals
- 256
- Pin Sayısı
- 256
- Permitted Cable Outer Temperature During Assemblinghandling
- -5 - 90
- Material Outer Sheath
- Polyvinyl chloride (PVC)
- Material Core Insulation
- Polyvinyl chloride (PVC)