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RoHS
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Technical team support
Specifications
- Maximum Drain Source Resistance Mohm
- 245@10V
- Process Technology
- HiperFET
- Package Height
- 5.55(Max)
- Typical Gate Charge Vgs Nc
- 264@10V
- Maximum Gate Source Leakage Current Na
- 200
- Package Length
- 25.25(Max)
- Typical Turnoff Delay Time Ns
- 66
- Package Width
- 23.25(Max)
- Mounting
- Surface Mount
- Number Of Elements Per Chip
- 1
- Maximum Gate Source Voltage V
- ±30
- Pin Sayısı
- 21
- Supplier Package
- SMPD
- Category
- Power MOSFET
- Typical Rise Time Ns
- 30
- Operating Junction Temperature C
- 150
- Maximum Drain Source Voltage V
- 1000
- Typical Turnon Delay Time Ns
- 48
- Maximum Idss Ua
- 50
- Minimum Operating Temperature C
- -55
- Parça Durumu
- Active
- Maximum Continuous Drain Current A
- 30
- Pcb Changed
- 21
- Ppap
- No
- Channel Mode
- Enhancement
- Configuration
- Single
- Automotive
- No
- Typical Input Capacitance Vds Pf
- 13600@25V
- Channel Type
- N
- Maximum Operating Temperature C
- 150
- Typical Gate Charge10v Nc
- 264
- Eu Rohs
- Compliant with Exemption
- Typical Fall Time Ns
- 28
- Maximum Gate Threshold Voltage V
- 6.5
- Maximum Power Dissipation Mw
- 694000
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