KVR26S19D8/16

Specifications

Minimum Operating Temperature C

0

Chip Configuration

1Gx8

Chip Density Bit

8G

Number Of Ranks

Dual

Package Description

,

Maximum Clock Rate Mhz

2666

Organization

2Gx64

Capacity

16 GB

Pll

No

Package Width

3.7(Max)

Module Density

16Gbyte

REACH Uyumluluk Kodu

unknown

Cas Latency

19

Package Height

30

Mounting

Socket

Supplier Package

SODIMM

Spd Eeprom Support

Yes

Gerilim

1.2V

Ecc Support

No

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Pin Sayısı

260

Module Sides

Double

Package Length

69.6

Maximum Operating Temperature C

85

Parça Durumu

Obsolete

Pins

260

RoHS Durumu

RoHS Compliant

Pc Type

PC4-2666

Eccn Us

EAR99

Data Bus Width Bit

64

Hts

8473.30.11.40

Chip Package Type

FBGA

Pcb Changed

260

Module

DRAM Module

Typical Operating Supply Voltage V

1.2

Number Of Chip Per Module

16

Üretici Parça No

KVR26S19D8/16

Memory Ic Type

DDR DRAM MODULE

Risk Rank

5.69

Self Refresh

Yes