KVR13S9S8/4

Specifications

Chip Package Type

FBGA

Memory Density

4

Data Bus Width Bit

64

Eccn Us

EAR99

Pc Type

PC3-10600

Yüzey Montaj

NO

Typical Operating Supply Voltage V

1.5

Access Mode

MULTI BANK PAGE BURST

Number Of Chip Per Module

8

Self Refresh

No

Part Life Cycle Code

Contact Manufacturer

Fonksiyon Sayısı

1

Maximum Clock Rate Mhz

1333

Number Of Ranks

Single

Package Shape

RECTANGULAR

Package Description

DIMM,

Organization

512Mx64

Additional Feature

PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM

Number Of Ports

1

Seated Heightmax

30 mm

Minimum Operating Temperature C

0

Terminal Formu

NO LEAD

Chip Density Bit

4G

Module Sides

Double

Operating Temperaturemax

85 °C

Mounting

Socket

Supplier Package

SODIMM

Cas Latency

9

Package Height

30

Supply Voltagemin Vsup

1.425 V

Ecc Support

No

Number Of Chip Banks

8

Pcb Changed

204

Hts

8542.32.00.24

Parça Durumu

LTB

Package Length

67.6

Terminal Pozisyonu

DUAL

Maximum Operating Temperature C

85

Number Of Words

536870912 words

Operating Mode

SYNCHRONOUS