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C3 ChipZentronix
KSM26SED8/16ME

Kingston Technology

KSM26SED8/16ME

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Specifications

Parça Durumu
Obsolete
Minimum Operating Temperature C
0
Module
DRAM Module
Mounting
Socket
Ecc Support
Yes
Data Bus Width Bit
72
Operating Current Ma
1629
Eccn Us
EAR99
RoHS Durumu
RoHS Compliant
Package Length
69.6
Maximum Operating Temperature C
85
Supplier Package
SODIMM
Hts
8473.30.11.40
Number Of Chip Per Module
18
Maximum Clock Rate Mhz
2666
Package Width
3.7(Max)
Module Type
260SODIMM
Organization
2Gx72
Number Of Ranks
Dual
Pcb Changed
260
Chip Configuration
1Gx8
Chip Package Type
FBGA
Cas Latency
17
Chip Density Bit
8G
Module Density
16Gbyte
Pin Sayısı
260
Package Height
30
Typical Operating Supply Voltage V
1.2

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