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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Height
- 31.25
- Pin Sayısı
- 288
- Typical Operating Supply Voltage V
- 1.2
- Risk Rank
- 5.83
- Chip Package Type
- FBGA
- Cas Latency
- 19
- Chip Density Bit
- 8G
- Module Density
- 16Gbyte
- Reflow Temperaturemax S
- NOT SPECIFIED
- Number Of Ranks
- Dual
- Pcb Changed
- 288
- Chip Configuration
- 1Gx8
- Maximum Clock Rate Mhz
- 2666
- Module Type
- 288DIMM
- Package Description
- ,
- Organization
- 2Gx72
- Rohs Code
- Yes
- Number Of Chip Per Module
- 18
- Part Life Cycle Code
- Obsolete
- Package Length
- 133.35
- Maximum Operating Temperature C
- 85
- Supplier Package
- RDIMM
- Üretici Parça No
- KSM26RD8/16HAI
- Ecc Support
- Yes
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- REACH Uyumluluk Kodu
- compliant
- Operating Current Ma
- 2010
- Data Bus Width Bit
- 72
- Ihs Manufacturer
- KINGSTON TECHNOLOGY COMPANY INC
- Eccn Us
- EAR99
- RoHS Durumu
- RoHS Compliant
- Parça Durumu
- Obsolete
- Minimum Operating Temperature C
- 0
- Memory Ic Type
- DDR DRAM MODULE
- Module
- DRAM Module
- Mounting
- Socket
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