KSM24SES8/8ME

Specifications

Chip Configuration

1Gx8

Number Of Ranks

Single

Pcb Changed

260

Organization

1Gx72

Module Type

260SODIMM

Package Width

3.7(Max)

Maximum Clock Rate Mhz

2400

Typical Operating Supply Voltage V

1.2

Pin Sayısı

260

Package Height

30

Module Density

8Gbyte

Cas Latency

17

Chip Density Bit

8G

Chip Package Type

FBGA

Eccn Us

EAR99

RoHS Durumu

Yes with exemptions

Data Bus Width Bit

72

Operating Current Ma

1305

Ecc Support

Yes

Mounting

Socket

Module

DRAM Module

Parça Durumu

Obsolete

Minimum Operating Temperature C

0

Number Of Chip Per Module

9

Supplier Package

SODIMM

Maximum Operating Temperature C

85

Package Length

69.6