HX426S15IB2/16

Specifications

Ecc Support

No

Chip Density Bit

8G

Chip Package Type

FBGA

Pll

No

Module Sides

Double

RoHS Durumu

Supplier Unconfirmed

Spd Eeprom Support

No

Pin Sayısı

260

Module

DRAM Module

Maximum Operating Temperature C

85

Cas Latency

15

Mounting

Socket

Number Of Chip Per Module

16

Pcb Changed

260

Parça Durumu

Obsolete

Module Density

16Gbyte

Package Height

30

Package Length

69.6

Maximum Clock Rate Mhz

2666

Typical Operating Supply Voltage V

1.2

Supplier Package

SODIMM

Module Type

260SODIMM

Organization

2Gx64

Chip Configuration

1Gx8

Data Bus Width Bit

64

Number Of Ranks

Dual

Eccn Us

EAR99

Minimum Operating Temperature C

0