HX316LS9IBK2/8

Specifications

Parça Durumu

Active

Pcb Changed

204

Number Of Chip Per Module

16

Cas Latency

9

Mounting

Socket

Module Density

8Gbyte

Package Height

30

Spd Eeprom Support

No

Module Sides

Double

RoHS Durumu

Yes with exemptions

Maximum Operating Temperature C

85

Pin Sayısı

204

Module

DRAM Module

Hts

8473.30.11.40

Lead Shape

No Lead

Pll

No

Chip Package Type

FBGA

Ecc Support

No

Chip Density Bit

4G

Maximum Operating Supply Voltage V

1.45/1.575

Number Of Ranks

Single

Minimum Operating Temperature C

0

Self Refresh

No

Eccn Us

EAR99

Data Bus Width Bit

64

Chip Configuration

512Mx8

Typical Operating Supply Voltage V

1.35/1.5

Maximum Clock Rate Mhz

1600

Module Type

204SODIMM

Organization

512Mx64x2

Number Of Chip Banks

8

Supplier Package

SODIMM

Package Length

67.6

Standard Package Name

DIMM

Minimum Operating Supply Voltage V

1.28/1.425