HX316LS9IBK2/16

Specifications

Ecc Support

No

Chip Density Bit

4G

Lead Shape

No Lead

Pll

No

Hts

8473.30.11.40

Chip Package Type

FBGA

Spd Eeprom Support

No

RoHS Durumu

Yes with exemptions

Module Sides

Double

Maximum Operating Temperature C

85

Module

DRAM Module

Pin Sayısı

204

Number Of Chip Per Module

32

Pcb Changed

204

Parça Durumu

Active

Mounting

Socket

Cas Latency

9

Package Height

30

Module Density

16Gbyte

Standard Package Name

DIMM

Package Length

67.6

Minimum Operating Supply Voltage V

1.28/1.425

Maximum Clock Rate Mhz

1600

Typical Operating Supply Voltage V

1.35/1.5

Organization

1Gx64x2

Module Type

204SODIMM

Supplier Package

SODIMM

Number Of Chip Banks

8

Data Bus Width Bit

64

Chip Configuration

512Mx8

Number Of Ranks

Dual

Maximum Operating Supply Voltage V

1.45/1.575

Eccn Us

EAR99

Self Refresh

No

Minimum Operating Temperature C

0