HX316LS9IB/8

Specifications

Data Bus Width Bit

64

Chip Configuration

512Mx8

Maximum Operating Supply Voltage V

1.45/1.575

Number Of Ranks

Dual

Eccn Us

EAR99

Self Refresh

No

Minimum Operating Temperature C

0

Package Length

67.6

Standard Package Name

DIMM

Minimum Operating Supply Voltage V

1.28/1.425

Typical Operating Supply Voltage V

1.35/1.5

Maximum Clock Rate Mhz

1600

Module Type

204SODIMM

Organization

1Gx64

Number Of Chip Banks

8

Supplier Package

SODIMM

Spd Eeprom Support

No

Module Sides

Double

RoHS Durumu

Yes with exemptions

Maximum Operating Temperature C

85

Pin Sayısı

204

Module

DRAM Module

Parça Durumu

Active

Number Of Chip Per Module

16

Pcb Changed

204

Cas Latency

9

Mounting

Socket

Module Density

8Gbyte

Package Height

30

Ecc Support

No

Chip Density Bit

4G

Lead Shape

No Lead

Pll

No

Hts

8473.30.11.40

Chip Package Type

FBGA