HX316LS9IB/4

Specifications

Package Height

30

Module Density

4Gbyte

Mounting

Socket

Cas Latency

9

Parça Durumu

Active

Number Of Chip Per Module

8

Pcb Changed

204

Module

DRAM Module

Pin Sayısı

204

Maximum Operating Temperature C

85

RoHS Durumu

Yes with exemptions

Module Sides

Double

Spd Eeprom Support

No

Chip Package Type

FBGA

Lead Shape

No Lead

Pll

No

Hts

8473.30.11.40

Ecc Support

No

Chip Density Bit

4G

Eccn Us

EAR99

Self Refresh

No

Minimum Operating Temperature C

0

Number Of Ranks

Single

Maximum Operating Supply Voltage V

1.45/1.575

Chip Configuration

512Mx8

Data Bus Width Bit

64

Supplier Package

SODIMM

Number Of Chip Banks

8

Organization

512Mx64

Module Type

204SODIMM

Maximum Clock Rate Mhz

1600

Typical Operating Supply Voltage V

1.35/1.5

Minimum Operating Supply Voltage V

1.28/1.425

Standard Package Name

DIMM

Package Length

67.6