TLP521-1XGBSM

Specifications

Gross Weight

700 g

Mounting

for back plate

2nd Connector Number Of Positions Loaded

universal

Number Of Channels

1

Material Finishing

anodized

Plate Thickness

3.5mm

Giriş Tipi

DC

Genişlik

105mm

Kılıf / Paket

4-SMD (0.300", 7.62mm)

Current Dc Forward If Max

50 mA

Voltage Isolation

5300Vrms

Mixed Contacts

100% @ 1mA

Current Output Channel

50mA

Heatsink Shape

U

Seri

TLP521-1

Montaj Tipi

Surface Mount

Yükseklik

23mm

Material

aluminium

Çıkış Tipi

Transistor

Type Of Heatsink

extruded

Tedarikçi Cihaz Paketi

4-SMD

Çalışma Sıcaklığı

-30°C ~ 100°C

Vce Saturation Max

400mV

Parça Durumu

Active

Voltage Output Max

55V

Turn On Turn Off Time Typ

3μs, 3μs

Uzunluk

1m

Voltage Forward Vf Typ

1.15V

Ambalaj

Tube

Colour

black

Rise Fall Time Typ

4μs, 3μs

Current Transfer Ratio Max

600% @ 1mA