Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Qualification Status
- Not Qualified
- Package Body Material
- PLASTIC/EPOXY
- Package Shape
- SQUARE
- Pin Sayısı
- 9
- Package Code
- BGA
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Number Of Terminals
- 9
- Package Description
- BGA,
- Part Life Cycle Code
- Transferred
- Terminal Formu
- BALL
- Jesd30 Code
- S-PBGA-B9
- Rohs Code
- Yes
- REACH Uyumluluk Kodu
- compliant
- Terminal Pozisyonu
- BOTTOM
- Package Style
- GRID ARRAY
- Supply Voltagenom
- 1.8 V
- Yüzey Montaj
- YES
- Fonksiyon Sayısı
- 1
- Uzunluk
- 1 mm
- Temperature Grade
- INDUSTRIAL
- Part Package Code
- BGA
- Telecom Ic Type
- TELECOM CIRCUIT
- Genişlik
- 1 mm
- HTS Kodu
- 8542.39.00.01
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Operating Temperaturemax
- 85 °C
- Ihs Manufacturer
- INTERSIL CORP
- Operating Temperaturemin
- -40 °C
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