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C3 ChipZentronix

Intersil Corporation

HM1-6641-9

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Qualification Status
Not Qualified
Memory Density
4096 bit
Organization
512X8
Operating Temperaturemax
85 °C
Terminal Pozisyonu
DUAL
Part Life Cycle Code
Obsolete
Package Equivalence Code
DIP24,.6
Number Of Terminals
24
Package Body Material
CERAMIC
JESD-609 Kodu
e0
Memory Ic Type
OTP ROM
Number Of Words Code
512
Package Code
DIP
Terminal Adımı
2.54 mm
Rohs Code
No
Terminal Formu
THROUGH-HOLE
ECCN Kodu
EAR99
Temperature Grade
INDUSTRIAL
HTS Kodu
8542.32.00.71
REACH Uyumluluk Kodu
not_compliant
Package Shape
RECTANGULAR
Jesd30 Code
R-XDIP-T24
Ihs Manufacturer
INTERSIL CORP
Memory Width
8
Yüzey Montaj
NO
Package Style
IN-LINE
Operating Temperaturemin
-40 °C
Number Of Words
512 words
Package Description
DIP, DIP24,.6
Terminal Kaplaması
Tin/Lead (Sn/Pb)

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