IRF540NPBF

Specifications

Additional Feature

HIGH RELIABILITY

Fet Type

N-Channel

Vgs Max

±20V

Rds On Max Id Vgs

44m Ω @ 16A, 10V

Tepe Reflow Sıcaklığı (°C)

250

Package Shape

RECTANGULAR

Case Connection

DRAIN

Yayın Yılı

1997

Genişlik

50mm

Soldering Hole Diameter

2.5 mm

Çap

10 mm

Plate Thickness

8mm

Çalışma Sıcaklığı

-55°C~175°C TJ

Terminal Formu

THROUGH-HOLE

Jesd30 Code

R-PSFM-T3

Nem Hassasiyeti (MSL)

1 (Unlimited)

Heatsinks Features

for use with ELS3 screw-in solder pin

Terminal Sayısı

3

Nominal Vgs

4 V

Threshold Voltage

4V

Element Configuration

Single

Material

aluminium

Contact Plating

Tin

Drainsource On Resistancemax

0.044 Ω

Turn On Delay Time

11 ns

Pulsed Drain Currentmax Idm

110 A

Maximum Current

24 A

Kılıf / Paket

TO-220-3

Mounting Hole Size

6 mm

Package Description

LEAD FREE PACKAGE-3

Yüzey Montaj

NO

Polaritychannel Type

N-CHANNEL

Gate To Source Voltage Vgs

20V

HTS Kodu

8541.29.00.95

Drain To Source Breakdown Voltage

100V

Seri

HEXFET®

Recovery Time

170 ns

Tepe Reflow Süresi (maks. sn)

30

Current Continuous Drain Id25

33A Tc

Montaj

Through Hole