RD38F2030W0ZTQ0

Specifications

Terminal Formu

BALL

Package Description

TFBGA, BGA88,8X12,32

Access Timemax

70 ns

ECCN Kodu

EAR99

Supply Voltagenom Vsup

1.8 V

Qualification Status

Not Qualified

Standby Currentmax

0.000015 A

Genişlik

8 mm

Supply Voltagemax Vsup

1.95 V

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Shape

RECTANGULAR

JESD-609 Kodu

e0

Package Code

TFBGA

Organization

4MX16

Additional Feature

CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH

Yüzey Montaj

YES

REACH Uyumluluk Kodu

compliant

Operating Mode

SYNCHRONOUS

Part Life Cycle Code

Obsolete

Jesd30 Code

R-PBGA-B88

Fonksiyon Sayısı

1

HTS Kodu

8542.32.00.71

Seated Heightmax

1.2 mm

Uzunluk

10 mm

Pin Sayısı

88

Package Equivalence Code

BGA88,8X12,32

Terminal Kaplaması

TIN LEAD

Terminal Adımı

0.8 mm

Ihs Manufacturer

INTEL CORP

Mixed Memory Type

FLASH+SRAM

Supply Voltagemin Vsup

1.7 V

Kurşunsuz Kodu

No

Rohs Code

No

Supply Currentmax

0.055 mA

Memory Ic Type

MEMORY CIRCUIT

Part Package Code

BGA

Number Of Words

4194304 words

Memory Density

67108864 bit

Terminal Pozisyonu

BOTTOM

Number Of Terminals

88