RD28F3208C3T70

Specifications

Memory Ic Type

MEMORY CIRCUIT

Rohs Code

No

Supply Currentmax

0.055 mA

Supply Voltagemin Vsup

2.7 V

Mixed Memory Type

FLASH+SRAM

Ihs Manufacturer

INTEL CORP

Package Equivalence Code

BGA68,8X12,32

Terminal Adımı

0.8 mm

Temperature Grade

COMMERCIAL EXTENDED

Number Of Words Code

2000000

Memory Width

16

Package Body Material

PLASTIC/EPOXY

Operating Temperaturemin

-25 °C

Operating Temperaturemax

85 °C

Number Of Terminals

66

Part Package Code

BGA

Number Of Words

2097152 words

Memory Density

33554432 bit

Terminal Pozisyonu

BOTTOM

Organization

2MX16

Package Code

LFBGA

Additional Feature

SRAM IS ORGANIZED AS 512K X 16

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltagemax Vsup

3.3 V

Package Shape

RECTANGULAR

Standby Currentmax

0.000006 A

Genişlik

8 mm

Qualification Status

Not Qualified

Access Timemax

70 ns

ECCN Kodu

EAR99

Supply Voltagenom Vsup

3 V

Tepe Reflow Süresi (maks. sn)

30

Terminal Formu

BALL

Package Description

LFBGA, BGA68,8X12,32

Pin Sayısı

66

Uzunluk

10 mm

HTS Kodu

8542.32.00.71

Seated Heightmax

1.4 mm

Fonksiyon Sayısı

1

Jesd30 Code

R-PBGA-B66