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Intel Corporation

RD28F3204W30B70

Specialized Modules

RoHS: Compliant

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Compliant

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Specifications

Package Body Material
PLASTIC/EPOXY
Memory Width
16
Number Of Words Code
2000000
Temperature Grade
OTHER
Terminal Pozisyonu
BOTTOM
Memory Density
33554432 bit
Number Of Words
2097152 words
Part Package Code
BGA
Operating Temperaturemax
85 °C
Number Of Terminals
80
Operating Temperaturemin
-25 °C
Supply Voltagemin Vsup
1.7 V
Memory Ic Type
MEMORY CIRCUIT
Terminal Adımı
0.8 mm
Ihs Manufacturer
INTEL CORP
Fonksiyon Sayısı
1
Seated Heightmax
1.4 mm
HTS Kodu
8542.32.00.71
Uzunluk
14 mm
Pin Sayısı
80
Yüzey Montaj
YES
REACH Uyumluluk Kodu
unknown
Part Life Cycle Code
Obsolete
Operating Mode
SYNCHRONOUS
Jesd30 Code
R-PBGA-B80
Genişlik
8 mm
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltagemax Vsup
1.9 V
Additional Feature
SRAM IS CONFIGURED AS 256K X 16
Package Code
LFBGA
Organization
2MX16
Package Description
LFBGA,
Terminal Formu
BALL
Supply Voltagenom Vsup
1.8 V
ECCN Kodu
EAR99
Qualification Status
Not Qualified

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