Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Kaplaması
- TIN LEAD
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Uzunluk
- 13 mm
- Part Package Code
- BGA
- Package Shape
- SQUARE
- Rohs Code
- No
- Part Life Cycle Code
- Transferred
- Speed
- 416 MHz
- JESD-609 Kodu
- e0
- Format
- FIXED POINT
- Terminal Pozisyonu
- BOTTOM
- Package Code
- VFBGA
- External Data Bus Width
- 32
- Clock Frequencymax
- 13.002 MHz
- Low Power Mode
- YES
- Package Style
- GRID ARRAY, VERY THIN PROFILE, FINE PITCH
- Jesd30 Code
- S-PBGA-B356
- Package Body Material
- PLASTIC/EPOXY
- Kurşunsuz Kodu
- No
- Ihs Manufacturer
- INTEL CORP
- Package Description
- VFBGA, BGA356,24X24,20
- Genişlik
- 13 mm
- Supply Voltagemax
- 1.705 V
- Terminal Adımı
- 0.5 mm
- Package Equivalence Code
- BGA356,24X24,20
- Supply Voltagenom
- 1.35 V
- Integrated Cache
- YES
- Pin Sayısı
- 356
- REACH Uyumluluk Kodu
- compliant
- Address Bus Width
- 26
- HTS Kodu
- 8542.31.00.01
- Supply Voltagemin
- 1.2825 V
- Qualification Status
- Not Qualified
- Boundary Scan
- YES
- Seated Heightmax
- 1 mm
- Terminal Formu
- BALL
- Yüzey Montaj
- YES
- Number Of Terminals
- 356
- Bit Size
- 32