PF38F5060M0Y0B0

Specifications

Terminal Adımı

0.8 mm

Temperature Grade

OTHER

Package Body Material

PLASTIC/EPOXY

Ihs Manufacturer

INTEL CORP

Package Code

TFBGA

Terminal Pozisyonu

BOTTOM

Number Of Terminals

105

Additional Feature

PSEUDO SRAM IS ORGANIZED AS 8M X 16

Standby Currentmax

0.00012 A

Jesd30 Code

R-PBGA-B105

Operating Mode

SYNCHRONOUS

Organization

32MX16

Operating Temperaturemin

-30 °C

Terminal Formu

BALL

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number Of Words Code

32000000

Memory Width

16

Kurşunsuz Kodu

Yes

Supply Voltagemax Vsup

2 V

Package Shape

RECTANGULAR

Operating Temperaturemax

85 °C

Access Timemax

96 ns

Tepe Reflow Sıcaklığı (°C)

260

HTS Kodu

8542.32.00.71

Supply Voltagemin Vsup

1.7 V

Seated Heightmax

1.2 mm

Tepe Reflow Süresi (maks. sn)

30

Genişlik

9 mm

Moisture Sensitivity Levels

3

Package Description

TFBGA, BGA105,9X12,32

Qualification Status

Not Qualified

Pin Sayısı

105

Memory Density

536870912 bit

Mixed Memory Type

FLASH+PSRAM

ECCN Kodu

EAR99

Fonksiyon Sayısı

1

REACH Uyumluluk Kodu

compliant

Part Life Cycle Code

Transferred

Yüzey Montaj

YES

Package Equivalence Code

BGA105,9X12,32