Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Genişlik
- 35 mm
- Seated Heightmax
- 2.51 mm
- Supply Voltagenom
- 1.4 V
- HTS Kodu
- 8542.31.00.01
- Package Style
- GRID ARRAY, HEAT SINK/SLUG
- Terminal Formu
- BALL
- Operating Temperaturemax
- 70 °C
- Package Shape
- SQUARE
- Format
- FIXED POINT
- Jesd30 Code
- S-PBGA-B544
- Terminal Pozisyonu
- BOTTOM
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Clock Frequencymax
- 66 MHz
- Number Of Terminals
- 544
- Package Code
- HBGA
- Ihs Manufacturer
- INTEL CORP
- Supply Voltagemin
- 1.33 V
- Package Body Material
- PLASTIC/EPOXY
- Temperature Grade
- COMMERCIAL
- Terminal Adımı
- 1.27 mm
- Part Package Code
- BGA
- JESD-609 Kodu
- e0
- Speed
- 667 MHz
- Rohs Code
- No
- Boundary Scan
- YES
- Uzunluk
- 35 mm
- Terminal Kaplaması
- TIN LEAD
- Part Life Cycle Code
- Obsolete
- Package Equivalence Code
- BGA544,26X26,50
- Yüzey Montaj
- YES
- Supply Voltagemax
- 1.47 V
- Integrated Cache
- YES
- Low Power Mode
- NO
- REACH Uyumluluk Kodu
- compliant
- Qualification Status
- Not Qualified
- Pin Sayısı
- 544
- Package Description
- HBGA, BGA544,26X26,50
- ECCN Kodu
- 3A991.A.2
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